1. The domestically produced YH86 Galaxy International ultra-precision machine tool has been finalized and is now in mass production; its 0.1 nm positioning accuracy fills a gap in the domestic market.
On June 25, the industry's industrialization achievements were announced, and this ultra-precision five-axis machine tool was officially delivered to the market, rivaling top-tier imported equipment from overseas.
· Key specifications: Repeatability of 0.1 nm; machining efficiency improved by 30% compared to imported models; overall manufacturing cost reduced by 60%;
· Application Scenarios: Ultra-precision machining of aircraft engine blades, semiconductor substrates, high-end optical molds, and silicon carbide substrates;
· Industrial Significance: Breaks the long-standing monopoly held by Japanese and Swiss companies in the field of nanometer-level precision machine tools and significantly reduces the procurement costs of high-end manufacturing equipment in China.
2. Upstream supply shocks: Price hikes and production halts for specialty semiconductor wafers and specialty electronic gases from overseas have forced domestic manufacturers of precision equipment to ramp up production.
Over the past two weeks, the global semiconductor materials supply chain has continued to tighten:
1. Japan's Shin-Etsu and SUMCO have raised prices for 12-inch AI-specific silicon wafers, with cumulative price increases for the year exceeding 25%;
2. Kanto Denka announced it would suspend production of tungsten hexafluoride (a specialty gas essential for etching 7nm and HBM chips, accounting for 25% of global production capacity) in July, causing spot prices to surge by 230%; downstream wafer fabs and packaging and testing companies are accelerating their shift to domestic orders for precision etching, deposition, and dicing equipment, with order volumes for domestic precision processing equipment manufacturers rising by 40% month-over-month.
3. Mass production validation of precision silicon carbide laser cutting equipment; substrate loss reduced to within 40 μm
Zhongwei Precision Instruments' self-developed SiC directional crack-induced cutting equipment has completed production line validation at a leading power company. While industry-standard cutting loss typically ranges from 80 to 120 μm, this domestically produced equipment cuts that loss in half. It is suitable for the mass production of 8-inch third-generation semiconductor substrates and has received tens of millions of yuan in additional industrial investment from Skyworth.
